hxwb6560l 450 c wire saw cutting machine

What Is a Diamond Wire Saw? Complete Guide to Wire Cutting

1. What Is a Diamond Wire Saw?

 

A diamond wire saw is a type of cutting machine that utilizes diamond wire.

 

They utilize wire as their method of cutting instead of standard blades.

 

They are made up of industrial grade diamond abrasive embedded within a wire.

 

Allowing for extremely precise cutting of brittle materials.

 

Many industries utilize diamond wire saw technology.

 

Some of these industries are semi conductor. Photo voltaics. Optics and high end ceramics.

 

Materials that cannot be cut by normal cutting methods.

 

Here are some examples of materials that can be cut by diamond wire.

 

  • Monocrystalline silicon

 

  • Polycrystalline silicon

 

  • SiC (Silicon Carbide)

 

  • Sapphire

 

  • Quartz

 

  • Glass

 

  • Advanced ceramics

 

  • Graphite

 

  • Optical Crystal

 

  • Certain types of Alloy

 

Another benefit to using diamond wire saw machines is that you can reduce your kerf.

 

Which will allow for higher yields when cutting crystals.

 

If you are looking to manufacture semi conductor’s. Then you will want to learn more about diamond wire saw technology.

 

It is used to cut ingots and slice precision semi conductors.

 

So to sum up what is a diamond wire saw.

 

A diamond wire saw is a machine that cuts with wire. That is covered in diamond abrasive.

 

Allowing for smaller kerf loss and more flexibility when cutting.

 

2. How Does A Diamond Wire Saw Work?

 

When a diamond wire saw cuts material it does so by using abrasion.

 

A part is placed inside of the cutting area.

 

A motor will spin the diamond wire in a direction.

 

The wire will also be under tension.

 

A feeder will move the part into the wire at a designated rate.

 

Allowing the diamonds to abrade the material.

 

This process will continue until your part has been sliced.

 

There is also a cooling fluid that can be applied during the cutting process.

 

2.1 Diamond Abrasive Cutting

 

Diamonds are one of the hardest materials on earth.

 

By utilizing this to our advantage we can abrade silicon, sapphire and many other materials.

 

Diamond wire saw machines are able to cut these materials because the abrasive is located on a wire.

 

Whereas regular cutting methods would not be able to cut with such a small kerf.

 

Of course there are many variables that will affect your cutting.

 

Speed, tension and feed rate all play a role.

 

2.2 How The Wire Travels

 

Diamond wire saw machines can travel in many ways.

 

Some machines have the ability to run in a continuous fashion. While others will go back and forth.

 

Both methods can work when cutting parts.

 

It all depends on the size of the part and your machines specifications.

 

2.3 Part Feeding

 

Feeding your part is very important when cutting.

 

You want to make sure that you feed at a steady rate. If you feed too fast the wire can deflect or break.

 

If you feed too slow you will reduce your output.

 

Which is why most diamond wire saws have servo feeders.

 

3. Diamond Wire Saw Machine Parts

 

Most diamond wire saw machines consist of many parts that all work together.

 

3.1 Wire

 

As previously mentioned the wire is what will be doing the cutting.

 

Diamond abrasive is applied to a wire allowing for parts to be cut.

 

Depending on the diameter of wire and abrasive you can obtain different results.

 

3.2 Motor

 

The motor will control how the wire moves.

 

Most machines use servo motors to accomplish this.

 

Allowing you to have more control over how your machine moves.

 

3.3 Guides

 

Diamond wire saws utilize many guides to keep the wire traveling in a certain path.

 

These guides will help control how your machine moves and cuts.

 

3.4 Tension System

 

Your tension system will keep the wire tight while cutting.

 

If your wire is too loose it can deflect while cutting. Too much tension can cause your wire to break.

 

Most diamond wire saw machines have an auto tension system.

 

3.5 Feed System

 

As we discussed earlier the feed system will move your part into the wire.

 

By having a servo driven feed you can ensure that your machine is cutting accurately.

 

There are also programs that can be ran to achieve different feed rates.

 

3.6 Chilling And Filter System

 

When cutting there is heat and material that needs to be removed.

 

Your chill system will accomplish this by washing over your cutting area.

 

3.7 PLC System

 

Most diamond wire saw machines have a PLC built into them.

 

Allowing you to change speed, tension and feed.

 

They will also have a screen to help program and control your machine.

 

4. Types Of Diamond Wire Saw Machines

 

There are many types of diamond wire saw machines that you can purchase.

 

4.1 Single Wire Diamond Saw

 

A single wire diamond saw will have one wire traveling through your machine.

 

This type of machine is good if you are trying to cut a specific material. Or just cutting samples.

 

You can also use a single wire diamond saw for more advanced cutting applications.

 

4.2 Multi Wire Diamond Saw

 

As the name implies a multi wire diamond saw will have many wires running through the machine.

 

Allowing you to cut many slices at once.

 

This is a popular way to slice wafers in the semi conductor industry.

 

4.3 Endless Diamond Wire Saw

 

Endless diamond wire saw machines will run the wire in one direction.

 

The wire will travel over wheels to keep it going.

 

Which will allow for a more precise cut.

 

4.4 Back and Forth Diamond Wire Saw

 

Similar to an endless machine this machine will run the wire back and forth.

 

Instead of running in one direction it will alternate directions.

 

Depending on what your trying to cut this could be beneficial.

 

4.5 Cnc Diamond Wire Saw

 

Some diamond wire saws can have cnc added onto them.

 

Allowing for more accurate cuts and repeatability.

 

5. Diamond Wire Saw Process

 

When cutting parts with a diamond wire saw there are many steps.

 

How to prepare your material.

 

You want to know what size you are cutting and what direction you need to cut in.

 

Install part on your fixture.

 

Make sure your part is secured to the fixture before cutting.

 

Prepare your machine.

 

Once your part is loaded make sure that your wire is in the correct position.

 

Set cutting parameters.

 

Adjust your speed, feed rate and tension. Make sure to change these based on what material your cutting.

 

Cut your part.

 

Start the machine and watch as it begins to cut.

 

Chill your machine.

 

By applying coolant to your machine you can remove material that builds up.

 

Finish Cut.

 

Once your part is done being sliced you can take it off the machine.

 

Inspect your part.

 

Check your part for any imperfections. You may need to grind and polish your part after cutting.

 

6. What Materials Can You Cut With Diamond Wire?

 

There are many materials that you can cut with a diamond wire saw.

 

Silicon

 

One of the most common materials that are cut by diamond wire. Used in the semi conductor and photo voltic industries.

 

SiC (Silicon Carbide)

 

SiC is a very hard material to cut. Which makes it perfect for diamond wire cutting. By cutting with a thinner kerf you can reduce material loss.

 

Sapphire

 

Sapphire is another material that can be cut by diamond wire saws. Due to its high hardness.

 

Quartz/Glass

 

Diamond wire can be used to cut these materials as well. Just make sure your cutting parameters are set correctly.

 

Advanced Ceramics

 

Like we previously stated advanced ceramics can be cut by diamond wire. Because of there hardness.

 

7. Diamond Wire Saw Semi Conductors

 

As we know diamond wire saws are used to cut many types of materials.

 

Including but not limited to silicon ingots and sapphire.

 

Cutting Silicon Ingots

 

Before slicing silicon wafers you need to have a crystal ready. Diamond wire can be used to cut these crystals down to size.

 

Slicing Silicon Wafers

 

Once you have a crystal ready to be sliced. A diamond wire saw can be used to cut many wafers at once.

 

Just make sure that your slicing parameters are set correctly.

 

Cutting SiC

 

Just like silicon diamond wire saws can be used to cut SiC. Since SiC is harder than silicon you will need to cut with more abrasion.

 

Sapphire

 

Diamond wire can also be used to cut sapphire. Allowing for more material to be used.

 

Diamond wire saws can be used to cut wafers. But they are not the only machines that are used.

 

After slicing wafers there are many more processes that occur. Grinding, lapping polishing etc.

 

8. Diamond Wire Saw Vs Normal Cutting Methods

 

Diamond wire saws have become popular due to there ability to cut hard materials.

 

But they are not the only method of cutting.

 

Feature

Diamond Wire Saw

Conventional Blade Saw

Cutting tool

Diamond abrasive wire

Rigid cutting blade

Kerf potential

Narrow

Depends on blade thickness

Hard material cutting

Excellent with suitable settings

Depends on blade and material

Multiwafer slicing

Available

Generally unsuitable

Cutting flexibility

High

Geometry dependent

Wire or blade wear

Requires monitoring

Requires monitoring

Semiconductor wafer production

Widely applicable

More limited for bulk slicing

 

As you can see diamond wire saws are better for cutting certain materials.

 

But normal cutting methods can still be used to cut material.

 

Depending on what your trying to cut and the size of your material. You may want to look into other cutting methods.

 

9. Benefits of Using a Diamond Wire Saw

 

There are many benefits that come with using a diamond wire saw.

 

Less Kerf Loss

 

Since you are cutting with wire you will have less kerf loss. Which will allow you to yield more material.

 

Cut With Higher Precision

 

Diamond wire saws have the ability to cut with high precision. Due to the fact that they use wires to cut.

 

Can Cut Harder Materials

 

With diamond wire you can cut materials that you normally would not be able to.

 

Higher Output

 

By having a multi wire diamond saw you can cut more material in less time.

 

Versatile

 

Diamond wire saws can be used to cut many different materials. Depending on your machine you can cut smaller samples or larger material.

 

Automation

 

Diamond wire saws can be automated to run with minimal human interaction.

 

Save Money

 

When cutting with a diamond wire saw you can save money by reducing your kerf loss.

 

 

10. Factors That Affect Diamond Wire Saw Cutting Process

When using a diamond wire saw machine there are several factors that must be kept in mind.

Wire Diameter

The diameter of the wire will effect the kerf width.

Which means that using a smaller diameter wire will lower your kerf loss.

Keep in mind you will have to maintain proper tension on the wire when using a thin diameter wire.

Wire Speed

Depending on what you are trying to cut you can go faster with the wire.

Using a faster wire speed can allow you to produce more parts per minute.

However if you go to fast with your wire speed it can cause more vibration or instability.

Wire Tension

Wire tension can play a major factor when cutting.

Making sure your tension is set correctly can allow for consistent cutting.

Feed Rate

The speed at which you feed the workpiece into the wire will play a role.

If you feed to fast you can increase your force on the cutting area.

If you feed to slow you will not be able to produce as many parts.

Coolant

Using coolant can allow for your cutting area to stay cool.

It can also flush out any material from the cutting area.

Surface Roughness

The finish that you get after cutting is what the roughness is.

You should always keep this in mind when cutting a part. Make sure your process allows for your desired finish.

Kerf Loss

Kerf loss is the amount of material that was removed when cutting a part.

The less material you can remove will give you more usable raw material.

Total Thickness Variation

TTV will come into play when slicing wafer.

The closer your TTV can be to zero the better off you will be when slicing wafers.

 

11. Uses For Diamond Wire Saw Machines

Diamond wire saw machines can be used in many industries.

Semi Conductors  Used to slice silicon wafers. Can be used to cut SiC substrates or other types of crystals.

Solar Panels  Slicing silicon wafers.

Optics  Cutting materials such as sapphire, quartz and crystals.

Ceramic Materials  Cutting hard ceramic materials.

Electronic Materials  Cutting certain materials for use in electronics.

Research Labs  Testing new materials or cutting samples.

 

As you can see there are many uses for a diamond wire saw machine.

 

12. What To Look For When Buying A Diamond Wire Saw Machine

There are many things to consider when purchasing a diamond wire saw.

Material being cut

Whether its silicon, SiC, sapphire or ceramic there will be different processes needed.

Size of material you want to cut

Make sure that the machine has enough travel and space to hold your material.

Type of cutting you need to do

Wafer slicing will require different parameters than cutting an ingot.

Amount of material you want to produce

If you want to produce a large amount of wafer then you would want to use a multiwire machine. Single wire can also be beneficial if you want to do specific cuts.

 

Below are some things that you should look at when buying a diamond wire saw.

 

  • Size of part that can be loaded
  • Wire Diameter
  • Wire Speed
  • Wire Tension
  • Feed Rate
  • Rigidity of machine
  • Accuracy
  • Kerf Width
  • Surface Finish
  • Chilling System
  • Filter
  • Level of automation
  • PLC and HMI

 

These are just some of the things to consider when looking at diamond wire saws. Make sure to think about what you will need for your downstream processes as well.

 

13. How To Maintain Your Diamond Wire Saw Machine

 

By keeping up on your diamond wire saw machine you will be able to achieve more consistent cutting results.

 

Check your wire path

Your guides should be in good shape when cutting.

 

Check your tension

Make sure that your wire is under the right amount of tension.

 

Keep up on your chill system.

 

Keeping your cutting fluid clean will help keep your cut consistent.

 

Lubricate your machine.

 

Always make note of your parameters when cutting.

 

This will help if anything changes while you are cutting. For example if you start breaking wire you can look back at your tension. If you start getting worse surface finishes you can check to see if your guides are worn or your feed rate is wrong.

 

14. Diamond Wire Saw Machines From Nanjing Top Wafer

 

Nanjing Top Wafer Precision Equipment Co., Ltd is located in Nanjing China. We supply semiconductor wafer equipment.

 

We have diamond wire saw machines that can cut many different materials.

 

We have both single wire and multiwire machines.

 

We also supply equipment that can be used after your wafers are sliced.

 

From grinding to polishing and cleaning we can supply many types of equipment.

 

Some of our diamond wire saw machines are used to slice:

 

  • Mono Silicon

 

  • Poly Silicon

 

  • SiC

 

  • Sapphire

 

  • Quartz

 

  • Ceramic

 

  • Other Crystals

 

We have machines that can handle many sizes of workpieces.

 

Check out our diamond wire saw machines and multi wire saws today.

 

15. Diamond Wire Saw FAQ

 

l What is a diamond wire saw?

A diamond wire saw is a machine that uses a diamond wire to cut materials.

 

l How does a diamond wire saw work?

A diamond wire saw will move a wire with diamonds attached to it over a workpiece. The workpiece is then fed into the wire at a set rate.

 

l What materials can be cut on a diamond wire saw?

Diamond wire saws can cut many different materials. From silicon to SiC to sapphire. You name it if it can be cut by wire we can probably do it.

 

l What is the difference between diamond wire and normal wire?

Diamond wire has diamonds attached to the wire which allow it to cut harder materials.

 

l What is a multi wire diamond saw?

A multi wire diamond saw will have multiple wires running down a track. Allowing for many wafer to be sliced at once.

 

l What is a single wire diamond saw?

A single wire diamond saw will only have one main cutting path. This type of machine is great if you want to cut unique parts.

 

l Can diamond wire saws cut SiC?

Diamond wire saws can cut SiC.

 

l Why are diamond wire saws used in the semi conductor industry?

They allow for thin kerf loss and can be used to slice many wafer at once.

 

l What is kerf loss?

Kerf loss is how much material is taken away when cutting.

 

l Will diamond wire cutting affect my silicon wafer?

Yes there will be some kind of damage when diamond wire cutting silicon. Usually these damages are ground away after slicing.

 

l What can affect your diamond wire saw accuracy?

There are many things that can affect your diamond wire saw accuracy. Some things that can play a factor are your machines rigidity, guide system, wire tension, feed rate and wire speed.

 

l Where can I buy a diamond wire saw?

You can buy a diamond wire saw from Nanjing Top Wafer Precision Equipment Co., Ltd.

 

16. Conclusion

 

Diamond wire saws are a great tool to have when cutting brittle materials.

 

They allow for thinner kerf loss then other types of cutting.

 

Multi wire diamond saws can help you increase your production by slicing many wafer at once.

 

Just remember there are many parameters that will affect your diamond wire saw process.

 

From wire diameter to your machine rigidity there are many things to consider.

 

Nanjing Top Wafer can provide you with diamond wire cutting machines and many other semi conductor machines.

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